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Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate

Patent ·
OSTI ID:1214588
The present invention generally provides semiconductor substrates having submicronsized surface features generated by irradiating the surface with ultra short laser pulses. In one aspect, a method of processing a semiconductor substrate is disclosed that includes placing at least a portion of a surface of the substrate in contact with a fluid, and exposing that surface portion to one or more femtosecond pulses so as to modify the topography of that portion. The modification can include, e.g., generating a plurality of submicron-sized spikes in an upper layer of the surface.
Research Organization:
President And Fellows Of Harvard College, Cambridge, MA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
;
Other Award/Contract Number:
FC36-01GO11053
Assignee:
President And Fellows Of Harvard College (Cambridge, MA)
Patent Number(s):
9,136,146
Application Number:
14/073,460
OSTI ID:
1214588
Country of Publication:
United States
Language:
English

References (19)

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Comparison of structure and properties of femtosecond and nanosecond laser-structured silicon journal March 2004
A uniform 290 nm periodic square structure on ZnO fabricated by two-beam femtosecond laser ablation journal November 2007
Temperature dependence of photoluminescence in noncrystalline silicon
  • Serpenguzel, Ali; Bilici, Temel; Inanc, Ibrahim
  • Integrated Optoelectronic Devices 2004: Proceedings Volume 5349, Physics and Simulation of Optoelectronic Devices XII, Vol. 5349 https://doi.org/10.1117/12.529549
conference June 2004