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Title: Laser tabbed die: A repairable, high-speed die-interconnection technology. 1994 LDRD final report 93-SR-089

Abstract

A unique technology for multichip module production is presented. The technology, called Laser Tabbed Die (L-TAB), consists of a method for forming surface-mount-type {open_quotes}gull wing{close_quotes} interconnects on bare dice. The dice are temporarily bonded to a sacrificial substrate which has a polymer thin film coated onto it. The gull wings are formed on the side of the die with a direct-write laser patterning process which allows vertical as well as horizontal image formation. Using the laser patterning system, trenches are formed in a positive electrodeposited photoresist (EDPR) which is plated onto a metal seed layer, allowing copper to be electroplated through the resultant mask. After stripping the resist and the metal seed layer, the polymer film on the substrate is dissolved, releasing the chip with the {open_quotes}gull wings{close_quotes} intact. The chips are then bonded onto a circuit board or permanent substrate with solder or conductive adhesive.

Authors:
;
Publication Date:
Research Org.:
Lawrence Livermore National Lab., CA (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
120877
Report Number(s):
UCRL-ID-122209
ON: DE96001869; TRN: 95:007872
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: Sep 1995
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; INTEGRATED CIRCUITS; FABRICATION; CONNECTORS; SOLDERING; LASER BEAM MACHINING; MICROELECTRONIC CIRCUITS

Citation Formats

Malba, V, and Bernhardt, A F. Laser tabbed die: A repairable, high-speed die-interconnection technology. 1994 LDRD final report 93-SR-089. United States: N. p., 1995. Web. doi:10.2172/120877.
Malba, V, & Bernhardt, A F. Laser tabbed die: A repairable, high-speed die-interconnection technology. 1994 LDRD final report 93-SR-089. United States. doi:10.2172/120877.
Malba, V, and Bernhardt, A F. Fri . "Laser tabbed die: A repairable, high-speed die-interconnection technology. 1994 LDRD final report 93-SR-089". United States. doi:10.2172/120877. https://www.osti.gov/servlets/purl/120877.
@article{osti_120877,
title = {Laser tabbed die: A repairable, high-speed die-interconnection technology. 1994 LDRD final report 93-SR-089},
author = {Malba, V and Bernhardt, A F},
abstractNote = {A unique technology for multichip module production is presented. The technology, called Laser Tabbed Die (L-TAB), consists of a method for forming surface-mount-type {open_quotes}gull wing{close_quotes} interconnects on bare dice. The dice are temporarily bonded to a sacrificial substrate which has a polymer thin film coated onto it. The gull wings are formed on the side of the die with a direct-write laser patterning process which allows vertical as well as horizontal image formation. Using the laser patterning system, trenches are formed in a positive electrodeposited photoresist (EDPR) which is plated onto a metal seed layer, allowing copper to be electroplated through the resultant mask. After stripping the resist and the metal seed layer, the polymer film on the substrate is dissolved, releasing the chip with the {open_quotes}gull wings{close_quotes} intact. The chips are then bonded onto a circuit board or permanent substrate with solder or conductive adhesive.},
doi = {10.2172/120877},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {9}
}