Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules
Conference
·
OSTI ID:1185961
- ORNL
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE)
- DOE Contract Number:
- DE-AC05-00OR22725
- OSTI ID:
- 1185961
- Resource Relation:
- Conference: IEEE International Workshop on Integrated Power Packaging, Chicago, IL, USA, 20150503, 20150503
- Country of Publication:
- United States
- Language:
- English
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