skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules

Authors:
 [1]
  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1185961
DOE Contract Number:
DE-AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: IEEE International Workshop on Integrated Power Packaging, Chicago, IL, USA, 20150503, 20150503
Country of Publication:
United States
Language:
English

Citation Formats

Liang, Zhenxian. Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules. United States: N. p., 2015. Web.
Liang, Zhenxian. Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules. United States.
Liang, Zhenxian. Thu . "Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules". United States. doi:.
@article{osti_1185961,
title = {Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules},
author = {Liang, Zhenxian},
abstractNote = {},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jan 01 00:00:00 EST 2015},
month = {Thu Jan 01 00:00:00 EST 2015}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

Save / Share: