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Title: Advanced Packaging Technologies for Fully Exploiting Attributes of WBG Power Electronics

  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
DOE Contract Number:
Resource Type:
Resource Relation:
Conference: IEEE International Workshop on Integrated Power Packaging, Chicago, IL, USA, 20150503, 20150503
Country of Publication:
United States

Citation Formats

Liang, Zhenxian. Advanced Packaging Technologies for Fully Exploiting Attributes of WBG Power Electronics. United States: N. p., 2015. Web.
Liang, Zhenxian. Advanced Packaging Technologies for Fully Exploiting Attributes of WBG Power Electronics. United States.
Liang, Zhenxian. 2015. "Advanced Packaging Technologies for Fully Exploiting Attributes of WBG Power Electronics". United States. doi:.
title = {Advanced Packaging Technologies for Fully Exploiting Attributes of WBG Power Electronics},
author = {Liang, Zhenxian},
abstractNote = {},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2015,
month = 1

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