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Title: Development of Packaging Technologies for Advanced SiC Power Modules

Authors:
 [1];  [1];  [1]
  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1185663
DOE Contract Number:
AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: The IEEE 2nd WiPDA 2014, Knoxville, TN, USA, 20141013, 20141015
Country of Publication:
United States
Language:
English

Citation Formats

Liang, Zhenxian, Wang, Fei, and Tolbert, Leon M. Development of Packaging Technologies for Advanced SiC Power Modules. United States: N. p., 2014. Web.
Liang, Zhenxian, Wang, Fei, & Tolbert, Leon M. Development of Packaging Technologies for Advanced SiC Power Modules. United States.
Liang, Zhenxian, Wang, Fei, and Tolbert, Leon M. Wed . "Development of Packaging Technologies for Advanced SiC Power Modules". United States. doi:. https://www.osti.gov/servlets/purl/1185663.
@article{osti_1185663,
title = {Development of Packaging Technologies for Advanced SiC Power Modules},
author = {Liang, Zhenxian and Wang, Fei and Tolbert, Leon M},
abstractNote = {},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 2014},
month = {Wed Jan 01 00:00:00 EST 2014}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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