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Title: Development of Packaging Technologies for Advanced SiC Power Modules

Authors:
 [1];  [1];  [1]
  1. ORNL
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
OSTI Identifier:
1185663
DOE Contract Number:
AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: The IEEE 2nd WiPDA 2014, Knoxville, TN, USA, 20141013, 20141015
Country of Publication:
United States
Language:
English

Citation Formats

Liang, Zhenxian, Wang, Fei, and Tolbert, Leon M. Development of Packaging Technologies for Advanced SiC Power Modules. United States: N. p., 2014. Web.
Liang, Zhenxian, Wang, Fei, & Tolbert, Leon M. Development of Packaging Technologies for Advanced SiC Power Modules. United States.
Liang, Zhenxian, Wang, Fei, and Tolbert, Leon M. 2014. "Development of Packaging Technologies for Advanced SiC Power Modules". United States. doi:. https://www.osti.gov/servlets/purl/1185663.
@article{osti_1185663,
title = {Development of Packaging Technologies for Advanced SiC Power Modules},
author = {Liang, Zhenxian and Wang, Fei and Tolbert, Leon M},
abstractNote = {},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2014,
month = 1
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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