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Title: Eddy current thickness measurement apparatus

Patent ·
OSTI ID:1184758

A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt.

Research Organization:
Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0000595
Assignee:
Varian Semiconductor Equipment Associates, Inc. (Gloucester, MA)
Patent Number(s):
9,057,146
Application Number:
12/862,187
OSTI ID:
1184758
Resource Relation:
Patent File Date: 2010 Aug 24
Country of Publication:
United States
Language:
English

References (15)

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Method and apparatus for supplying molten metal in the manufacture of amorphous metal ribbons patent May 1986
Guidance system for low angle silicon ribbon growth patent July 1986
Coriolis mass flow rate meter patent September 1995
Eddy current testing system with scanning probe head having parallel and normal sensing coils patent January 1996
Instantaneous slag thickness measuring device patent July 1998
Method and apparatus for measuring thickness of conductive films with the use of inductive and capacitive sensors patent July 2003
Floating Sheet Production Apparatus and Method patent-application September 2009
Method and Apparatus for Producing a Dislocation-Free Crystalline Sheet patent-application December 2009
Eddy current-type coating thickness gauge journal November 1991
Application of pulsed eddy current and ultrasonic sensors in paint film thickness measuring conference June 2009
Measurement of the spatio-temporal distribution of harmonic and transient eddy currents in a liquid metal journal February 2008
Multifrequency eddy current diagnostics of axial and radial thermal profiles during silicon crystal growth journal December 1990
A Contactless Inductive Velocity Reconstruction Method for Metallic and Semiconducting Melts journal October 2004