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Title: Methods and systems for in-situ electroplating of electrodes

Patent ·
OSTI ID:1183448

The present techniques provide electrochemical devices having enhanced electrodes with surfaces that facilitate operation, such as by formation of a porous nickel layer on an operative surface, particularly of the cathode. The porous metal layer increases the surface area of the electrode, which may result in increasing the efficiency of the electrochemical devices. The formation of the porous metal layer is performed in situ, that is, after the assembly of the electrodes into an electrochemical device. The in situ process offers a number of advantages, including the ability to protect the porous metal layer on the electrode surface from damage during assembly of the electrochemical device. The enhanced electrode and the method for its processing may be used in any number of electrochemical devices, and is particularly well suited for electrodes in an electrolyzer useful for splitting water into hydrogen and oxygen.

Research Organization:
General Electric Co., Schenectady, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FC07-06ID14789
Assignee:
General Electric Company (Schenectady, NY)
Patent Number(s):
9,045,839
Application Number:
12/136,331
OSTI ID:
1183448
Country of Publication:
United States
Language:
English

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