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Title: Thermal flux limited electron Kapitza conductance in copper-niobium multilayers

Abstract

The interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers was studied. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffuse mismatch model. The results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.

Authors:
 [1];  [2];  [1];  [3];  [1];  [2];  [2];  [2];  [4];  [5];  [1]
  1. Univ. of Virginia, Charlottesville, VA (United States)
  2. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
  3. Univ. of California, Berkeley, CA (United States)
  4. Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
  5. Univ. of Michigan, Ann Arbor, MI (United States)
Publication Date:
Research Org.:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1183079
Alternate Identifier(s):
OSTI ID: 1420541
Report Number(s):
SAND-2014-16696J
Journal ID: ISSN 0003-6951; 534589
Grant/Contract Number:
AC04-94AL85000
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 106; Journal Issue: 09; Journal ID: ISSN 0003-6951
Publisher:
American Institute of Physics (AIP)
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats

Cheaito, Ramez, Hattar, Khalid Mikhiel, Gaskins, John T., Yadav, Ajay K., Duda, John C., Beechem, III, Thomas Edwin, Ihlefeld, Jon, Piekos, Edward S., Baldwin, Jon K., Misra, Amit, and Hopkins, Patrick E.. Thermal flux limited electron Kapitza conductance in copper-niobium multilayers. United States: N. p., 2015. Web. doi:10.1063/1.4913420.
Cheaito, Ramez, Hattar, Khalid Mikhiel, Gaskins, John T., Yadav, Ajay K., Duda, John C., Beechem, III, Thomas Edwin, Ihlefeld, Jon, Piekos, Edward S., Baldwin, Jon K., Misra, Amit, & Hopkins, Patrick E.. Thermal flux limited electron Kapitza conductance in copper-niobium multilayers. United States. doi:10.1063/1.4913420.
Cheaito, Ramez, Hattar, Khalid Mikhiel, Gaskins, John T., Yadav, Ajay K., Duda, John C., Beechem, III, Thomas Edwin, Ihlefeld, Jon, Piekos, Edward S., Baldwin, Jon K., Misra, Amit, and Hopkins, Patrick E.. Thu . "Thermal flux limited electron Kapitza conductance in copper-niobium multilayers". United States. doi:10.1063/1.4913420. https://www.osti.gov/servlets/purl/1183079.
@article{osti_1183079,
title = {Thermal flux limited electron Kapitza conductance in copper-niobium multilayers},
author = {Cheaito, Ramez and Hattar, Khalid Mikhiel and Gaskins, John T. and Yadav, Ajay K. and Duda, John C. and Beechem, III, Thomas Edwin and Ihlefeld, Jon and Piekos, Edward S. and Baldwin, Jon K. and Misra, Amit and Hopkins, Patrick E.},
abstractNote = {The interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers was studied. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffuse mismatch model. The results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.},
doi = {10.1063/1.4913420},
journal = {Applied Physics Letters},
number = 09,
volume = 106,
place = {United States},
year = {Thu Mar 05 00:00:00 EST 2015},
month = {Thu Mar 05 00:00:00 EST 2015}
}

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Cited by: 4 works
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