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Title: Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices

Abstract

The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Inventors:
; ; ;
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1178275
Patent Number(s):
9,010,405
Application Number:
13/021,853
Assignee:
U.S. Department of Energy (Washington, DC) GFO
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Patent
Resource Relation:
Patent File Date: 2011 Feb 07
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Bharathan, Desikan, Bennion, Kevin, Kelly, Kenneth, and Narumanchi, Sreekant. Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices. United States: N. p., 2015. Web.
Bharathan, Desikan, Bennion, Kevin, Kelly, Kenneth, & Narumanchi, Sreekant. Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices. United States.
Bharathan, Desikan, Bennion, Kevin, Kelly, Kenneth, and Narumanchi, Sreekant. Tue . "Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices". United States. doi:. https://www.osti.gov/servlets/purl/1178275.
@article{osti_1178275,
title = {Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices},
author = {Bharathan, Desikan and Bennion, Kevin and Kelly, Kenneth and Narumanchi, Sreekant},
abstractNote = {The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 21 00:00:00 EDT 2015},
month = {Tue Apr 21 00:00:00 EDT 2015}
}

Patent:

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Works referenced in this record:

Thermofluid analysis of staggered and inline pin fin heat sinks
conference, January 2000

  • Dvinsky, A.; Bar-Cohen, A.; Strelets, M.
  • ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
  • DOI: 10.1109/ITHERM.2000.866822