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Title: Packaged die heater

Abstract

A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

Inventors:
; ;
Publication Date:
Research Org.:
Honeywell International Inc., Morristown, NJ (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1176428
Patent Number(s):
7,965,094
Application Number:
12/172,317
Assignee:
Honeywell International Inc. (Morristown, NJ) OSTI
DOE Contract Number:  
FC26-06NT42947
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Spielberger, Richard, Ohme, Bruce Walker, and Jensen, Ronald J. Packaged die heater. United States: N. p., 2011. Web.
Spielberger, Richard, Ohme, Bruce Walker, & Jensen, Ronald J. Packaged die heater. United States.
Spielberger, Richard, Ohme, Bruce Walker, and Jensen, Ronald J. Tue . "Packaged die heater". United States. https://www.osti.gov/servlets/purl/1176428.
@article{osti_1176428,
title = {Packaged die heater},
author = {Spielberger, Richard and Ohme, Bruce Walker and Jensen, Ronald J.},
abstractNote = {A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 21 00:00:00 EDT 2011},
month = {Tue Jun 21 00:00:00 EDT 2011}
}

Patent:

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