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Title: High precision, rapid laser hole drilling

Abstract

A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.

Inventors:
; ;
Publication Date:
Research Org.:
The Regents of the University of California, Oakland, CA (United States); Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1176157
Patent Number(s):
7,193,175
Application Number:
11/040,588
Assignee:
The Regents of the University of California (Oakland, CA) OSTI
DOE Contract Number:
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chang, Jim J., Friedman, Herbert W., and Comaskey, Brian J.. High precision, rapid laser hole drilling. United States: N. p., 2007. Web.
Chang, Jim J., Friedman, Herbert W., & Comaskey, Brian J.. High precision, rapid laser hole drilling. United States.
Chang, Jim J., Friedman, Herbert W., and Comaskey, Brian J.. Tue . "High precision, rapid laser hole drilling". United States. doi:. https://www.osti.gov/servlets/purl/1176157.
@article{osti_1176157,
title = {High precision, rapid laser hole drilling},
author = {Chang, Jim J. and Friedman, Herbert W. and Comaskey, Brian J.},
abstractNote = {A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 20 00:00:00 EDT 2007},
month = {Tue Mar 20 00:00:00 EDT 2007}
}

Patent:

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