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Title: Power converter having improved terminal structure

Abstract

A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Inventors:
; ; ;
Publication Date:
Research Org.:
Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1176136
Patent Number(s):
7,187,568
Application Number:
10/252,457
Assignee:
Rockwell Automation Technologies, Inc. (Mayfield Heights, OH) OSTI
DOE Contract Number:
FC02-99EE50571
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
24 POWER TRANSMISSION AND DISTRIBUTION; 42 ENGINEERING

Citation Formats

Radosevich, Lawrence D., Kannenberg, Daniel G., Phillips, Mark G., and Kaishian, Steven C. Power converter having improved terminal structure. United States: N. p., 2007. Web.
Radosevich, Lawrence D., Kannenberg, Daniel G., Phillips, Mark G., & Kaishian, Steven C. Power converter having improved terminal structure. United States.
Radosevich, Lawrence D., Kannenberg, Daniel G., Phillips, Mark G., and Kaishian, Steven C. Tue . "Power converter having improved terminal structure". United States. doi:. https://www.osti.gov/servlets/purl/1176136.
@article{osti_1176136,
title = {Power converter having improved terminal structure},
author = {Radosevich, Lawrence D. and Kannenberg, Daniel G. and Phillips, Mark G. and Kaishian, Steven C.},
abstractNote = {A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 06 00:00:00 EST 2007},
month = {Tue Mar 06 00:00:00 EST 2007}
}

Patent:

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  • EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry viamore » plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.« less
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  • A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assemblymore » and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.« less