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Title: Vehicle drive module having improved cooling configuration

Abstract

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1176107
Patent Number(s):
7,177,153
Application Number:
10/252,317
Assignee:
Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
DOE Contract Number:  
FC02-99EE50571
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
33 ADVANCED PROPULSION SYSTEMS

Citation Formats

Radosevich, Lawrence D., Meyer, Andreas A., Kannenberg, Daniel G., Kaishian, Steven C., and Beihoff, Bruce C. Vehicle drive module having improved cooling configuration. United States: N. p., 2007. Web.
Radosevich, Lawrence D., Meyer, Andreas A., Kannenberg, Daniel G., Kaishian, Steven C., & Beihoff, Bruce C. Vehicle drive module having improved cooling configuration. United States.
Radosevich, Lawrence D., Meyer, Andreas A., Kannenberg, Daniel G., Kaishian, Steven C., and Beihoff, Bruce C. Tue . "Vehicle drive module having improved cooling configuration". United States. https://www.osti.gov/servlets/purl/1176107.
@article{osti_1176107,
title = {Vehicle drive module having improved cooling configuration},
author = {Radosevich, Lawrence D. and Meyer, Andreas A. and Kannenberg, Daniel G. and Kaishian, Steven C. and Beihoff, Bruce C.},
abstractNote = {An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2007},
month = {2}
}

Patent:

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