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Title: Power converter having improved EMI shielding

Abstract

EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Inventors:
; ; ; ; ;
Publication Date:
Research Org.:
Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175792
Patent Number(s):
7,061,775
Application Number:
10/252,303
Assignee:
Rockwell Automation Technologies, Inc. (Mayfield Heights, OH) OSTI
DOE Contract Number:
FC02-99EE50571
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
30 DIRECT ENERGY CONVERSION

Citation Formats

Beihoff, Bruce C., Kehl, Dennis L., Gettelfinger, Lee A., Kaishian, Steven C., Phillips, Mark G., and Radosevich, Lawrence D. Power converter having improved EMI shielding. United States: N. p., 2006. Web.
Beihoff, Bruce C., Kehl, Dennis L., Gettelfinger, Lee A., Kaishian, Steven C., Phillips, Mark G., & Radosevich, Lawrence D. Power converter having improved EMI shielding. United States.
Beihoff, Bruce C., Kehl, Dennis L., Gettelfinger, Lee A., Kaishian, Steven C., Phillips, Mark G., and Radosevich, Lawrence D. 2006. "Power converter having improved EMI shielding". United States. doi:. https://www.osti.gov/servlets/purl/1175792.
@article{osti_1175792,
title = {Power converter having improved EMI shielding},
author = {Beihoff, Bruce C. and Kehl, Dennis L. and Gettelfinger, Lee A. and Kaishian, Steven C. and Phillips, Mark G. and Radosevich, Lawrence D.},
abstractNote = {EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 2006,
month = 6
}

Patent:

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  • A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled tomore » electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.« less
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