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Title: Method of joining ITM materials using a partially or fully-transient liquid phase

Patent ·
OSTI ID:1175669

A method of forming a composite structure includes: (1) providing first and second sintered bodies containing first and second multicomponent metallic oxides having first and second identical crystal structures that are perovskitic or fluoritic; (2) providing a joint material containing at least one metal oxide: (a) containing (i) at least one metal of an identical IUPAC Group as at least one sintered body metal in one of the multicomponent metallic oxides, (ii) a first row D-Block transition metal not contained in the multicomponent metallic oxides, and/or (iii) a lanthanide not contained in the multicomponent metallic oxides; (b) free of metals contained in the multicomponent metallic oxides; (c) free of cations of boron, silicon, germanium, tin, lead, arsenic, antimony, phosphorus and tellurium; and (d) having a melting point below the sintering temperatures of the sintered bodies; and (3) heating to a joining temperature above the melting point and below the sintering temperatures.

Research Organization:
Air Products and Chemicals, Inc., Allentown, PA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FC-98FT40343
Assignee:
Air Products and Chemicals, Inc. (Allentown, PA)
Patent Number(s):
7,011,898
Application Number:
10/393,954
OSTI ID:
1175669
Country of Publication:
United States
Language:
English

References (7)

Reaction Processing and Properties of Sic-To-Sic Joints journal January 1993
The reactive route to ceramic joining: fabrication, interfacial chemistryand joint properties journal April 1998
A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint journal March 1988
Application of Ceramic-Metal Eutectics for Solid-State Bonding Between Ceramics book January 1992
Joining of Alumina Ceramics Using Nanocrystalline Tape Cast Interlayer journal August 2000
Modelling of transient liquid phase bonding journal January 1995
Partial transient liquid-phase metals layer technique of ceramic-metal bonding journal January 1991

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