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Title: Micro-tensile testing system

Abstract

A micro-tensile testing system providing a stand-alone test platform for testing and reporting physical or engineering properties of test samples of materials having thicknesses of approximately between 0.002 inch and 0.030 inch, including, for example, LiGA engineered materials. The testing system is able to perform a variety of static, dynamic, and cyclic tests. The testing system includes a rigid frame and adjustable gripping supports to minimize measurement errors due to deflection or bending under load; serrated grips for securing the extremely small test sample; high-speed laser scan micrometers for obtaining accurate results; and test software for controlling the testing procedure and reporting results.

Inventors:
Publication Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175610
Patent Number(s):
6,983,658
Application Number:
10/412,508
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MD) OSTI
DOE Contract Number:
AC04-01AL66850
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Wenski, Edward G. Micro-tensile testing system. United States: N. p., 2006. Web.
Wenski, Edward G. Micro-tensile testing system. United States.
Wenski, Edward G. Tue . "Micro-tensile testing system". United States. doi:. https://www.osti.gov/servlets/purl/1175610.
@article{osti_1175610,
title = {Micro-tensile testing system},
author = {Wenski, Edward G.},
abstractNote = {A micro-tensile testing system providing a stand-alone test platform for testing and reporting physical or engineering properties of test samples of materials having thicknesses of approximately between 0.002 inch and 0.030 inch, including, for example, LiGA engineered materials. The testing system is able to perform a variety of static, dynamic, and cyclic tests. The testing system includes a rigid frame and adjustable gripping supports to minimize measurement errors due to deflection or bending under load; serrated grips for securing the extremely small test sample; high-speed laser scan micrometers for obtaining accurate results; and test software for controlling the testing procedure and reporting results.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 10 00:00:00 EST 2006},
month = {Tue Jan 10 00:00:00 EST 2006}
}

Patent:

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  • A micro-tensile testing system providing a stand-alone test platform for testing and reporting physical or engineering properties of test samples of materials having thicknesses of approximately between 0.002 inch and 0.030 inch, including, for example, LiGA engineered materials. The testing system is able to perform a variety of static, dynamic, and cyclic tests. The testing system includes a rigid frame and adjustable gripping supports to minimize measurement errors due to deflection or bending under load; serrated grips for securing the extremely small test sample; high-speed laser scan micrometers for obtaining accurate results; and test software for controlling the testing proceduremore » and reporting results.« less
  • A micro-tensile testing system providing a stand-alone test platform for testing and reporting physical or engineering properties of test samples of materials having thicknesses of approximately between 0.002 inch and 0.030 inch, including, for example, LiGA engineered materials. The testing system is able to perform a variety of static, dynamic, and cyclic tests. The testing system includes a rigid frame and adjustable gripping supports to minimize measurement errors due to deflection or bending under load; serrated grips for securing the extremely small test sample; high-speed laser scan micrometers for obtaining accurate results; and test software for controlling the testing proceduremore » and reporting results.« less
  • A micromachined or microelectromechanical system (MEMS) based push-to-pull mechanical transformer for tensile testing of micro-to-nanometer scale material samples including a first structure and a second structure. The second structure is coupled to the first structure by at least one flexible element that enables the second structure to be moveable relative to the first structure, wherein the second structure is disposed relative to the first structure so as to form a pulling gap between the first and second structures such that when an external pushing force is applied to and pushes the second structure in a tensile extension direction a widthmore » of the pulling gap increases so as to apply a tensile force to a test sample mounted across the pulling gap between a first sample mounting area on the first structure and a second sample mounting area on the second structure.« less
  • A micromachined or microelectromechanical system (MEMS) based push-to-pull mechanical transformer for tensile testing of micro-to-nanometer scale material samples including a first structure and a second structure. The second structure is coupled to the first structure by at least one flexible element that enables the second structure to be moveable relative to the first structure, wherein the second structure is disposed relative to the first structure so as to form a pulling gap between the first and second structures such that when an external pushing force is applied to and pushes the second structure in a tensile extension direction a widthmore » of the pulling gap increases so as to apply a tensile force to a test sample mounted across the pulling gap between a first sample mounting area on the first structure and a second sample mounting area on the second structure.« less
  • For one-dimensional (1D) structures such as tubes, wires, and beams, tensile testing is a simple and reliable methodology for measuring their mechanical properties. The tensile offset angle effect on mechanical property measurement has long been ignored. In this study, theoretical and finite-element analysis (FEA) models for analyzing the tensile offset angle effect have been established. It is found that longitudinal stress decreases with increasing offset angles. The theoretically calculated elastic modulus relative errors reach 4.45% at the offset angle of 10 deg., whereas the experimentally measured elastic modulus relative errors are 45.4% at the offset angle of 15 deg. Themore » difference in elastic modulus relative errors between the theoretical analysis and the experimental results is discussed with reference to the sensing system in the experimental instrumentation. To accurately measure the mechanical properties using the tensile testing technique, perfect alignment with a zero or small offset angle less than 5 deg. is needed. A calibration methodology for aligning specimens has been developed.« less