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Title: Modular power converter having fluid cooled support

Abstract

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175570
Patent Number(s):
6,972,957
Application Number:
10/252,296
Assignee:
Rockwell Automation Technologies, Inc. (Mayfield Heights, OH) OSTI
DOE Contract Number:
FC02-99EE50571
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
30 DIRECT ENERGY CONVERSION

Citation Formats

Beihoff, Bruce C., Radosevich, Lawrence D., Meyer, Andreas A., Gollhardt, Neil, and Kannenberg, Daniel G.. Modular power converter having fluid cooled support. United States: N. p., 2005. Web.
Beihoff, Bruce C., Radosevich, Lawrence D., Meyer, Andreas A., Gollhardt, Neil, & Kannenberg, Daniel G.. Modular power converter having fluid cooled support. United States.
Beihoff, Bruce C., Radosevich, Lawrence D., Meyer, Andreas A., Gollhardt, Neil, and Kannenberg, Daniel G.. Tue . "Modular power converter having fluid cooled support". United States. doi:. https://www.osti.gov/servlets/purl/1175570.
@article{osti_1175570,
title = {Modular power converter having fluid cooled support},
author = {Beihoff, Bruce C. and Radosevich, Lawrence D. and Meyer, Andreas A. and Gollhardt, Neil and Kannenberg, Daniel G.},
abstractNote = {A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 06 00:00:00 EST 2005},
month = {Tue Dec 06 00:00:00 EST 2005}
}

Patent:

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