skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Flip-chip light emitting diode with resonant optical microcavity

Abstract

A flip-chip light emitting diode with enhanced efficiency. The device structure employs a microcavity structure in a flip-chip configuration. The microcavity enhances the light emission in vertical modes, which are readily extracted from the device. Most of the rest of the light is emitted into waveguided lateral modes. Flip-chip configuration is advantageous for light emitting diodes (LEDs) grown on dielectric substrates (e.g., gallium nitride LEDs grown on sapphire substrates) in general due to better thermal dissipation and lower series resistance. Flip-chip configuration is advantageous for microcavity LEDs in particular because (a) one of the reflectors is a high-reflectivity metal ohmic contact that is already part of the flip-chip configuration, and (b) current conduction is only required through a single distributed Bragg reflector. Some of the waveguided lateral modes can also be extracted with angled sidewalls used for the interdigitated contacts in the flip-chip configuration.

Inventors:
; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1175565
Patent Number(s):
6,969,874
Application Number:
10/459,965
Assignee:
Sandia Corporation SNL-L
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Gee, James M., Bogart, Katherine H.A., and Fischer, Arthur J. Flip-chip light emitting diode with resonant optical microcavity. United States: N. p., 2005. Web.
Gee, James M., Bogart, Katherine H.A., & Fischer, Arthur J. Flip-chip light emitting diode with resonant optical microcavity. United States.
Gee, James M., Bogart, Katherine H.A., and Fischer, Arthur J. Tue . "Flip-chip light emitting diode with resonant optical microcavity". United States. doi:. https://www.osti.gov/servlets/purl/1175565.
@article{osti_1175565,
title = {Flip-chip light emitting diode with resonant optical microcavity},
author = {Gee, James M. and Bogart, Katherine H.A. and Fischer, Arthur J.},
abstractNote = {A flip-chip light emitting diode with enhanced efficiency. The device structure employs a microcavity structure in a flip-chip configuration. The microcavity enhances the light emission in vertical modes, which are readily extracted from the device. Most of the rest of the light is emitted into waveguided lateral modes. Flip-chip configuration is advantageous for light emitting diodes (LEDs) grown on dielectric substrates (e.g., gallium nitride LEDs grown on sapphire substrates) in general due to better thermal dissipation and lower series resistance. Flip-chip configuration is advantageous for microcavity LEDs in particular because (a) one of the reflectors is a high-reflectivity metal ohmic contact that is already part of the flip-chip configuration, and (b) current conduction is only required through a single distributed Bragg reflector. Some of the waveguided lateral modes can also be extracted with angled sidewalls used for the interdigitated contacts in the flip-chip configuration.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Nov 29 00:00:00 EST 2005},
month = {Tue Nov 29 00:00:00 EST 2005}
}

Patent:

Save / Share: