Encapsulants for protecting MEMS devices during post-packaging release etch

Patent · Tue Oct 18 00:00:00 EDT 2005

OSTI ID:1175530

Peterson, Kenneth A.

The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.

• Research Organization: ~Individually Owned Patent
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• Assignee: Peterson, Kenneth A.
• Patent Number(s): 6,956,283
• Application Number: 10/606,525
• OSTI ID: 1175530
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING