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Title: Encapsulants for protecting MEMS devices during post-packaging release etch

Abstract

The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.

Inventors:
Publication Date:
Research Org.:
~Individually Owned Patent
Sponsoring Org.:
USDOE
OSTI Identifier:
1175530
Patent Number(s):
6,956,283
Application Number:
10/606,525
Assignee:
Peterson, Kenneth A.
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Peterson, Kenneth A. Encapsulants for protecting MEMS devices during post-packaging release etch. United States: N. p., 2005. Web.
Peterson, Kenneth A. Encapsulants for protecting MEMS devices during post-packaging release etch. United States.
Peterson, Kenneth A. Tue . "Encapsulants for protecting MEMS devices during post-packaging release etch". United States. https://www.osti.gov/servlets/purl/1175530.
@article{osti_1175530,
title = {Encapsulants for protecting MEMS devices during post-packaging release etch},
author = {Peterson, Kenneth A.},
abstractNote = {The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a "package first, release later" manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.},
doi = {},
url = {https://www.osti.gov/biblio/1175530}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {10}
}

Patent:

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