Skip to main content
OSTI.GOVU.S. Department of Energy Office of Scientific and Technical Information
U.S. Department of Energy
Office of Scientific and Technical Information
 

Cascaded die mountings with spring-loaded contact-bond options

Patent ·
OSTI ID:1175468
; ; ; ; ;
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC05-00OR22725
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Number(s):
6,930,385
Application Number:
10/738,746
OSTI ID:
1175468
Country of Publication:
United States
Language:
English

References (2)

Dimple-array interconnect technique for packaging power semiconductor devices and modules conference
Flip-chip flex-circuit packaging for 42 V/16 A integrated power electronics module applications
  • Xiao, Y.; Natarajan, R.; Chow, T. P.
  • APEC 2002 - Applied Power Electronics Conference and Exposition, APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335) https://doi.org/10.1109/APEC.2002.989222
conference January 2002

Similar Records

Related Subjects

42 ENGINEERING