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Vapor-deposited porous films for energy conversion

Patent ·
OSTI ID:1175417
Metallic films are grown with a "spongelike" morphology in the as-deposited condition using planar magnetron sputtering. The morphology of the deposit is characterized by metallic continuity in three dimensions with continuous and open porosity on the submicron scale. The stabilization of the spongelike morphology is found over a limited range of the sputter deposition parameters, that is, of working gas pressure and substrate temperature. This spongelike morphology is an extension of the features as generally represented in the classic zone models of growth for physical vapor deposits. Nickel coatings were deposited with working gas pressures up 4 Pa and for substrate temperatures up to 1000 K. The morphology of the deposits is examined in plan and in cross section views with scanning electron microscopy (SEM). The parametric range of gas pressure and substrate temperature (relative to absolute melt point) under which the spongelike metal deposits are produced appear universal for other metals including gold, silver, and aluminum.
Research Organization:
The Regents of the University of California, Oakland, CA (United States); Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-48;
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Number(s):
6,913,998
Application Number:
10/612,177
OSTI ID:
1175417
Country of Publication:
United States
Language:
English

References (3)

Micromachined reactors for catalytic partial oxidation reactions journal November 1997
Sputter deposition of cermet fuel electrodes for solid oxide fuel cells journal May 1995
Experimental system for the study of gas-solid heterogeneous catalysis in microreactors conference August 2000

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