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Title: Method and apparatus of cryogenic cooling for high temperature superconductor devices

Abstract

A method and apparatus for providing cryogenic cooling to HTS devices, in particular those that are used in high-voltage electric power applications. The method involves pressurizing liquid cryogen to above one atmospheric pressure to improve its dielectric strength, while sub-cooling the liquid cryogen to below its saturation temperature in order to improve the performance of the HTS components of the device. An apparatus utilizing such a cooling method consists of a vessel that contains a pressurized gaseous cryogen region and a sub-cooled liquid cryogen bath, a liquid cryogen heating coupled with a gaseous cryogen venting scheme to maintain the pressure of the cryogen to a value in a range that corresponds to optimum dielectric strength of the liquid cryogen, and a cooling system that maintains the liquid cryogen at a temperature below its boiling point to improve the performance of HTS materials used in the device.

Inventors:
;
Publication Date:
Research Org.:
Superpower, Inc.
Sponsoring Org.:
USDOE
OSTI Identifier:
1175237
Patent Number(s):
6,854,276
Application Number:
10/465,089
Assignee:
Superpower, Inc.
DOE Contract Number:  
FC36-03G013033
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Yuan, Xing, and Mine, Susumu. Method and apparatus of cryogenic cooling for high temperature superconductor devices. United States: N. p., 2005. Web.
Yuan, Xing, & Mine, Susumu. Method and apparatus of cryogenic cooling for high temperature superconductor devices. United States.
Yuan, Xing, and Mine, Susumu. Tue . "Method and apparatus of cryogenic cooling for high temperature superconductor devices". United States. https://www.osti.gov/servlets/purl/1175237.
@article{osti_1175237,
title = {Method and apparatus of cryogenic cooling for high temperature superconductor devices},
author = {Yuan, Xing and Mine, Susumu},
abstractNote = {A method and apparatus for providing cryogenic cooling to HTS devices, in particular those that are used in high-voltage electric power applications. The method involves pressurizing liquid cryogen to above one atmospheric pressure to improve its dielectric strength, while sub-cooling the liquid cryogen to below its saturation temperature in order to improve the performance of the HTS components of the device. An apparatus utilizing such a cooling method consists of a vessel that contains a pressurized gaseous cryogen region and a sub-cooled liquid cryogen bath, a liquid cryogen heating coupled with a gaseous cryogen venting scheme to maintain the pressure of the cryogen to a value in a range that corresponds to optimum dielectric strength of the liquid cryogen, and a cooling system that maintains the liquid cryogen at a temperature below its boiling point to improve the performance of HTS materials used in the device.},
doi = {},
url = {https://www.osti.gov/biblio/1175237}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2005},
month = {2}
}

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