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Title: Methods for fabricating a micro heat barrier

Abstract

Methods for fabricating a highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (<0.1 micron), to minimize the tip's contact area. A heat source can be placed directly on the microspikes. The micro heat barrier can have an apparent thermal conductivity in the range of 10.sup.-6 to 10.sup.-7 W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.

Inventors:
; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174662
Patent Number(s):
6,673,254
Application Number:
10/025,446
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats

Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., and Vawter, Gregory A. Methods for fabricating a micro heat barrier. United States: N. p., 2004. Web.
Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., & Vawter, Gregory A. Methods for fabricating a micro heat barrier. United States.
Marshall, Albert C., Kravitz, Stanley H., Tigges, Chris P., and Vawter, Gregory A. Tue . "Methods for fabricating a micro heat barrier". United States. https://www.osti.gov/servlets/purl/1174662.
@article{osti_1174662,
title = {Methods for fabricating a micro heat barrier},
author = {Marshall, Albert C. and Kravitz, Stanley H. and Tigges, Chris P. and Vawter, Gregory A.},
abstractNote = {Methods for fabricating a highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (<0.1 micron), to minimize the tip's contact area. A heat source can be placed directly on the microspikes. The micro heat barrier can have an apparent thermal conductivity in the range of 10.sup.-6 to 10.sup.-7 W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.},
doi = {},
url = {https://www.osti.gov/biblio/1174662}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2004},
month = {1}
}

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