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Title: Uniformly dense polymeric foam body

Patent ·
OSTI ID:1174403

A method for providing a uniformly dense polymer foam body having a density between about 0.013 g/cm.sup.3 to about 0.5 g/cm.sup.3 is disclosed. The method utilizes a thermally expandable polymer microsphere material wherein some of the microspheres are unexpanded and some are only partially expanded. It is shown that by mixing the two types of materials in appropriate ratios to achieve the desired bulk final density, filling a mold with this mixture so as to displace all or essentially all of the internal volume of the mold, heating the mold for a predetermined interval at a temperature above about 130.degree. C., and then cooling the mold to a temperature below 80.degree. C. the molded part achieves a bulk density which varies by less then about .+-.6% everywhere throughout the part volume.

Research Organization:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Livermore, CA)
Patent Number(s):
6,593,381
Application Number:
10/210,534
OSTI ID:
1174403
Country of Publication:
United States
Language:
English

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