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Title: High thermal conductivity lossy dielectric using co-densified multilayer configuration

Abstract

Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.

Inventors:
;
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174377
Patent Number(s):
6,579,393
Application Number:
09/837,891
Assignee:
Lockheed Martin Energy Research Corporation (Oak Ridge, TN) OSTI
DOE Contract Number:  
AC05-96OR22464
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats

Tiegs, Terry N., and Kiggans, Jr., James O. High thermal conductivity lossy dielectric using co-densified multilayer configuration. United States: N. p., 2003. Web.
Tiegs, Terry N., & Kiggans, Jr., James O. High thermal conductivity lossy dielectric using co-densified multilayer configuration. United States.
Tiegs, Terry N., and Kiggans, Jr., James O. Tue . "High thermal conductivity lossy dielectric using co-densified multilayer configuration". United States. https://www.osti.gov/servlets/purl/1174377.
@article{osti_1174377,
title = {High thermal conductivity lossy dielectric using co-densified multilayer configuration},
author = {Tiegs, Terry N. and Kiggans, Jr., James O.},
abstractNote = {Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {6}
}

Patent:

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