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Title: Method and system for automated on-chip material and structural certification of MEMS devices

Abstract

A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1174341
Patent Number(s):
6,567,715
Application Number:
09/553,989
Assignee:
Sandia Corporation (Albuquerque, NM)
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Sinclair, Michael B., DeBoer, Maarten P., Smith, Norman F., Jensen, Brian D., and Miller, Samuel L. Method and system for automated on-chip material and structural certification of MEMS devices. United States: N. p., 2003. Web.
Sinclair, Michael B., DeBoer, Maarten P., Smith, Norman F., Jensen, Brian D., & Miller, Samuel L. Method and system for automated on-chip material and structural certification of MEMS devices. United States.
Sinclair, Michael B., DeBoer, Maarten P., Smith, Norman F., Jensen, Brian D., and Miller, Samuel L. Tue . "Method and system for automated on-chip material and structural certification of MEMS devices". United States. https://www.osti.gov/servlets/purl/1174341.
@article{osti_1174341,
title = {Method and system for automated on-chip material and structural certification of MEMS devices},
author = {Sinclair, Michael B. and DeBoer, Maarten P. and Smith, Norman F. and Jensen, Brian D. and Miller, Samuel L.},
abstractNote = {A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2003},
month = {5}
}

Patent:

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