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Title: Development of Interconnect Technologies for Particle Detectors

Abstract

This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.

Authors:
 [1]
  1. Univ. of California, Davis, CA (United States)
Publication Date:
Research Org.:
The Regents of the University of California, Davis, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1168993
Report Number(s):
DOE-DAVIS-005268-1
DOE Contract Number:
SC0005268
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
43 PARTICLE ACCELERATORS

Citation Formats

Tripathi, Mani. Development of Interconnect Technologies for Particle Detectors. United States: N. p., 2015. Web. doi:10.2172/1168993.
Tripathi, Mani. Development of Interconnect Technologies for Particle Detectors. United States. doi:10.2172/1168993.
Tripathi, Mani. Thu . "Development of Interconnect Technologies for Particle Detectors". United States. doi:10.2172/1168993. https://www.osti.gov/servlets/purl/1168993.
@article{osti_1168993,
title = {Development of Interconnect Technologies for Particle Detectors},
author = {Tripathi, Mani},
abstractNote = {This final report covers the three years of this grant, for the funding period 9/1/2010 - 8/31/2013. The project consisted of generic detector R&D work at UC Davis, with an emphasis on developing interconnect technologies for applications in HEP. Much of the work is done at our Facility for Interconnect Technologies (FIT) at UC Davis. FIT was established using ARRA funds, with further studies supported by this grant. Besides generic R&D work at UC Davis, FIT is engaged in providing bump bonding help to several DOE supported detector R&D efforts. Some of the developmental work was also supported by funding from other sources: continuing CMS project funds and the Linear Collider R&D funds. The latter program is now terminated. The three year program saw a good deal of progress on several fronts, which are reported here.},
doi = {10.2172/1168993},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jan 29 00:00:00 EST 2015},
month = {Thu Jan 29 00:00:00 EST 2015}
}

Technical Report:

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