Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
Patent
·
OSTI ID:1165428
Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
- Research Organization:
- International Business Machines Corporation, Armonk, NY (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- EE0002894
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Number(s):
- 8,913,384
- Application Number:
- 13/527,947
- OSTI ID:
- 1165428
- Country of Publication:
- United States
- Language:
- English
Packaging design of the IBM System z10 Enterprise Class platform central electronic complex
|
journal | January 2009 |
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