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Title: Solder Interconnect Predictor (SIP) Software Package.

Abstract

Abstract not provided.

Authors:
; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1157550
Report Number(s):
SAND2007-1866C
523652
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the PWB/CCA Process Group Spring Face to Face Meeting preceded by PSMT & Pre-Pg Meeting held March 27-30, 2007 in Clearwater, FL.
Country of Publication:
United States
Language:
English

Citation Formats

Neilsen, Michael K., Vianco, Paul T, Holm, Elizabeth A, and Burchett, Steve. Solder Interconnect Predictor (SIP) Software Package.. United States: N. p., 2007. Web.
Neilsen, Michael K., Vianco, Paul T, Holm, Elizabeth A, & Burchett, Steve. Solder Interconnect Predictor (SIP) Software Package.. United States.
Neilsen, Michael K., Vianco, Paul T, Holm, Elizabeth A, and Burchett, Steve. Thu . "Solder Interconnect Predictor (SIP) Software Package.". United States. doi:. https://www.osti.gov/servlets/purl/1157550.
@article{osti_1157550,
title = {Solder Interconnect Predictor (SIP) Software Package.},
author = {Neilsen, Michael K. and Vianco, Paul T and Holm, Elizabeth A and Burchett, Steve},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Mar 01 00:00:00 EST 2007},
month = {Thu Mar 01 00:00:00 EST 2007}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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