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Title: Methods for integrating a functional component into a microfluidic device

Abstract

Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity, which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate, which may include microchannels or other features.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
SNL-A (Sandia National Laboratories, Albuquerque, NM (United States))
Sponsoring Org.:
USDOE
OSTI Identifier:
1150712
Patent Number(s):
8,808,588
Application Number:
12/012,653
Assignee:
Sandia Corporation (Albuquerque, NM) SNL-A
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
47 OTHER INSTRUMENTATION

Citation Formats

Simmons, Blake, Domeier, Linda, Woo, Noble, Shepodd, Timothy, and Renzi, Ronald F. Methods for integrating a functional component into a microfluidic device. United States: N. p., 2014. Web.
Simmons, Blake, Domeier, Linda, Woo, Noble, Shepodd, Timothy, & Renzi, Ronald F. Methods for integrating a functional component into a microfluidic device. United States.
Simmons, Blake, Domeier, Linda, Woo, Noble, Shepodd, Timothy, and Renzi, Ronald F. Tue . "Methods for integrating a functional component into a microfluidic device". United States. doi:. https://www.osti.gov/servlets/purl/1150712.
@article{osti_1150712,
title = {Methods for integrating a functional component into a microfluidic device},
author = {Simmons, Blake and Domeier, Linda and Woo, Noble and Shepodd, Timothy and Renzi, Ronald F.},
abstractNote = {Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity, which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate, which may include microchannels or other features.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 19 00:00:00 EDT 2014},
month = {Tue Aug 19 00:00:00 EDT 2014}
}

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