skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Method of forming an HTS article

Abstract

A method of forming a superconducting article includes providing a substrate tape, forming a superconducting layer overlying the substrate tape, and depositing a capping layer overlying the superconducting layer. The capping layer includes a noble metal and has a thickness not greater than about 1.0 micron. The method further includes electrodepositing a stabilizer layer overlying the capping layer using a solution that is non-reactive to the superconducting layer. The superconducting layer has an as-formed critical current I.sub.C(AF) and a post-stabilized critical current I.sub.C(PS). The I.sub.C(PS) is at least about 95% of the I.sub.C(AF).

Inventors:
; ;
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1150644
Patent Number(s):
8,809,237
Application Number:
12/033,660
Assignee:
SuperPower, Inc. (Schenectady, NY) NREL
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Bhattacharya, Raghu N., Zhang, Xun, and Selvamanickam, Venkat. Method of forming an HTS article. United States: N. p., 2014. Web.
Bhattacharya, Raghu N., Zhang, Xun, & Selvamanickam, Venkat. Method of forming an HTS article. United States.
Bhattacharya, Raghu N., Zhang, Xun, and Selvamanickam, Venkat. Tue . "Method of forming an HTS article". United States. https://www.osti.gov/servlets/purl/1150644.
@article{osti_1150644,
title = {Method of forming an HTS article},
author = {Bhattacharya, Raghu N. and Zhang, Xun and Selvamanickam, Venkat},
abstractNote = {A method of forming a superconducting article includes providing a substrate tape, forming a superconducting layer overlying the substrate tape, and depositing a capping layer overlying the superconducting layer. The capping layer includes a noble metal and has a thickness not greater than about 1.0 micron. The method further includes electrodepositing a stabilizer layer overlying the capping layer using a solution that is non-reactive to the superconducting layer. The superconducting layer has an as-formed critical current I.sub.C(AF) and a post-stabilized critical current I.sub.C(PS). The I.sub.C(PS) is at least about 95% of the I.sub.C(AF).},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {8}
}

Patent:

Save / Share:

Works referenced in this record: