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Title: Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

Abstract

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.

Authors:
; ;
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE Office of Energy Efficiency and Renewable Energy Vehicle Technologies Office
OSTI Identifier:
1150186
Report Number(s):
NREL/CP-5400-61598
Journal ID: ISSN 2380--4491
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Conference
Resource Relation:
Journal Volume: 2014; Journal Issue: HITEC; Conference: Presented at IMAPS/HiTEC, 13-15 May 2014, Albuquerque, New Mexico
Country of Publication:
United States
Language:
English
Subject:
33 ADVANCED PROPULSION SYSTEMS; 30 DIRECT ENERGY CONVERSION; BONDED INTERFACES; SINTERED-SILVER; RELIABILITY; DELAMINATION; STRESS INTENSITY; Transportation

Citation Formats

DeVoto, D. J., Paret, P. P., and Wereszczak, A. A.. Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint. United States: N. p., 2014. Web. doi:10.4071/HITEC-WA26.
DeVoto, D. J., Paret, P. P., & Wereszczak, A. A.. Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint. United States. doi:10.4071/HITEC-WA26.
DeVoto, D. J., Paret, P. P., and Wereszczak, A. A.. Fri . "Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint". United States. doi:10.4071/HITEC-WA26. https://www.osti.gov/servlets/purl/1150186.
@article{osti_1150186,
title = {Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint},
author = {DeVoto, D. J. and Paret, P. P. and Wereszczak, A. A.},
abstractNote = {In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.},
doi = {10.4071/HITEC-WA26},
journal = {},
number = HITEC,
volume = 2014,
place = {United States},
year = {Fri Aug 01 00:00:00 EDT 2014},
month = {Fri Aug 01 00:00:00 EDT 2014}
}

Conference:
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