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Title: Fabrication of Ultrathin Integrated Multilayer Capacitors by Chemical Solution Deposition.

Abstract

Abstract not provided.

Authors:
; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1148187
Report Number(s):
SAND2007-2845C
523245
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the 13 US-Japan Seminar on Dielectric and Piezoelectric Ceramics held November 4-7, 2007 in Awaji city, Hyogo, Japan.
Country of Publication:
United States
Language:
English

Citation Formats

Tuttle, Bruce, Parish, Chad Michael, Brewer, Luke N., McKenzie, Bonnie Beth, and Rodriguez, Mark A. Fabrication of Ultrathin Integrated Multilayer Capacitors by Chemical Solution Deposition.. United States: N. p., 2007. Web.
Tuttle, Bruce, Parish, Chad Michael, Brewer, Luke N., McKenzie, Bonnie Beth, & Rodriguez, Mark A. Fabrication of Ultrathin Integrated Multilayer Capacitors by Chemical Solution Deposition.. United States.
Tuttle, Bruce, Parish, Chad Michael, Brewer, Luke N., McKenzie, Bonnie Beth, and Rodriguez, Mark A. Tue . "Fabrication of Ultrathin Integrated Multilayer Capacitors by Chemical Solution Deposition.". United States. doi:. https://www.osti.gov/servlets/purl/1148187.
@article{osti_1148187,
title = {Fabrication of Ultrathin Integrated Multilayer Capacitors by Chemical Solution Deposition.},
author = {Tuttle, Bruce and Parish, Chad Michael and Brewer, Luke N. and McKenzie, Bonnie Beth and Rodriguez, Mark A},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 01 00:00:00 EDT 2007},
month = {Tue May 01 00:00:00 EDT 2007}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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