Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn-3.9Ag-0.6Cu Lead-Free Solder.

Journal Article · Sun Jul 01 00:00:00 EDT 2007 · IEEE Journal of Electronic Packaging

OSTI ID:1147408

Vianco, Paul T.; Neilsen, Michael K. ^[1]; Pierce, David M.; Sheppard, Sheri D.; Fossum, Arlo F.

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1. Sandia National Laboratories, Kansas City, MO

Abstract not provided.

• Research Organization: Sandia National Laboratories Kansas City, MO; Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: DE-AC04-94AL85000
• OSTI ID: 1147408
• Report Number(s): SAND2007-4837J; 522139
• Journal Information: IEEE Journal of Electronic Packaging, Related Information: Proposed for publication in IEEE Journal of Electronic Packaging.
• Country of Publication: United States
• Language: English