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Title: Enhanced Thermal Bondlines: Nanocomposite Thermal Interface Material and the Minimization of Bondline Thermal Resistance.

Abstract

Abstract not provided.

Authors:
; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1141464
Report Number(s):
SAND2006-2398C
506524
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the MS&T '05 (Manufacturing Science & Technology 2005 Conference and Exhibition) held September 26-28, 2005 in Pittsburgy, PA.
Country of Publication:
United States
Language:
English

Citation Formats

Rae, David Fraser, Emerson, John A., Galloway, Jeffrey Alan, Rightley, Michael J., Huber, Dale L., and Cott, Eric J. Enhanced Thermal Bondlines: Nanocomposite Thermal Interface Material and the Minimization of Bondline Thermal Resistance.. United States: N. p., 2006. Web.
Rae, David Fraser, Emerson, John A., Galloway, Jeffrey Alan, Rightley, Michael J., Huber, Dale L., & Cott, Eric J. Enhanced Thermal Bondlines: Nanocomposite Thermal Interface Material and the Minimization of Bondline Thermal Resistance.. United States.
Rae, David Fraser, Emerson, John A., Galloway, Jeffrey Alan, Rightley, Michael J., Huber, Dale L., and Cott, Eric J. Sat . "Enhanced Thermal Bondlines: Nanocomposite Thermal Interface Material and the Minimization of Bondline Thermal Resistance.". United States. doi:. https://www.osti.gov/servlets/purl/1141464.
@article{osti_1141464,
title = {Enhanced Thermal Bondlines: Nanocomposite Thermal Interface Material and the Minimization of Bondline Thermal Resistance.},
author = {Rae, David Fraser and Emerson, John A. and Galloway, Jeffrey Alan and Rightley, Michael J. and Huber, Dale L. and Cott, Eric J.},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Apr 01 00:00:00 EST 2006},
month = {Sat Apr 01 00:00:00 EST 2006}
}

Conference:
Other availability
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