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Title: Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules.

Abstract

Abstract not provided.

Authors:
; ; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1141227
Report Number(s):
SAND2012-9564J
505571
DOE Contract Number:  
DE-AC04-94AL85000
Resource Type:
Journal Article
Journal Name:
IEEE Transactions
Additional Journal Information:
Related Information: Proposed for publication in IEEE Transactions.
Country of Publication:
United States
Language:
English

Citation Formats

Rodenbeck, Christopher T., Peterson, Kenneth A, Sandoval, Charles E., Russick, Edward Mark, Ortiz, Ray A., Brakora, Karl, and Jack Thiessen. Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules.. United States: N. p., 2012. Web.
Rodenbeck, Christopher T., Peterson, Kenneth A, Sandoval, Charles E., Russick, Edward Mark, Ortiz, Ray A., Brakora, Karl, & Jack Thiessen. Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules.. United States.
Rodenbeck, Christopher T., Peterson, Kenneth A, Sandoval, Charles E., Russick, Edward Mark, Ortiz, Ray A., Brakora, Karl, and Jack Thiessen. Thu . "Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules.". United States.
@article{osti_1141227,
title = {Electrooptic Inspection of Vector Leakage in Radiofrequency Multichip Modules.},
author = {Rodenbeck, Christopher T. and Peterson, Kenneth A and Sandoval, Charles E. and Russick, Edward Mark and Ortiz, Ray A. and Brakora, Karl and Jack Thiessen},
abstractNote = {Abstract not provided.},
doi = {},
journal = {IEEE Transactions},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {11}
}