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Title: A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.

Abstract

Abstract not provided.

Authors:
; ; ; ; ; ; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1141164
Report Number(s):
SAND2011-3519C
506086
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the 61st Electronic Components and Technology Conference held May 31 - June 3, 2011 in Lake Buena Vista, FL.
Country of Publication:
United States
Language:
English

Citation Formats

Olsson, Roy H.,, Nordquist, Christopher, Peterson, Tracy C., Shul, Randy John, Ahlers, Catalina, Plut, Thomas A., Patrizi, Gary A., and Chanchani, Rajen. A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.. United States: N. p., 2011. Web.
Olsson, Roy H.,, Nordquist, Christopher, Peterson, Tracy C., Shul, Randy John, Ahlers, Catalina, Plut, Thomas A., Patrizi, Gary A., & Chanchani, Rajen. A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.. United States.
Olsson, Roy H.,, Nordquist, Christopher, Peterson, Tracy C., Shul, Randy John, Ahlers, Catalina, Plut, Thomas A., Patrizi, Gary A., and Chanchani, Rajen. Sun . "A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.". United States. doi:. https://www.osti.gov/servlets/purl/1141164.
@article{osti_1141164,
title = {A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.},
author = {Olsson, Roy H., and Nordquist, Christopher and Peterson, Tracy C. and Shul, Randy John and Ahlers, Catalina and Plut, Thomas A. and Patrizi, Gary A. and Chanchani, Rajen},
abstractNote = {Abstract not provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun May 01 00:00:00 EDT 2011},
month = {Sun May 01 00:00:00 EDT 2011}
}

Conference:
Other availability
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