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Title: Suppressing tin whisker growth in lead-free solders and platings

Abstract

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.

Inventors:
;
Publication Date:
Research Org.:
Savannah River Site (SRS), Aiken, SC (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1130083
Patent Number(s):
8,709,179
Application Number:
13/269,803
Assignee:
Savannah River Nuclear Solutions, LLC (Aiken, SC) SRNL
DOE Contract Number:  
AC09-08SR22470
Resource Type:
Patent
Resource Relation:
Patent File Date: 2011 Oct 10
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Hoffman, Elizabeth N, and Lam, Poh-Sang. Suppressing tin whisker growth in lead-free solders and platings. United States: N. p., 2014. Web.
Hoffman, Elizabeth N, & Lam, Poh-Sang. Suppressing tin whisker growth in lead-free solders and platings. United States.
Hoffman, Elizabeth N, and Lam, Poh-Sang. Tue . "Suppressing tin whisker growth in lead-free solders and platings". United States. doi:. https://www.osti.gov/servlets/purl/1130083.
@article{osti_1130083,
title = {Suppressing tin whisker growth in lead-free solders and platings},
author = {Hoffman, Elizabeth N and Lam, Poh-Sang},
abstractNote = {A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 29 00:00:00 EDT 2014},
month = {Tue Apr 29 00:00:00 EDT 2014}
}

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Works referenced in this record:

Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits
journal, November 2005


Spontaneous whisker growth on lead-free solder finishes
journal, November 2005