Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors
Journal Article
·
· IEEE Trans.Nucl.Sci.
OSTI ID:1128851
- Research Organization:
- Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), High Energy Physics (HEP)
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 1128851
- Report Number(s):
- FERMILAB-PUB-13-517-PPD
- Journal Information:
- IEEE Trans.Nucl.Sci., Journal Name: IEEE Trans.Nucl.Sci.
- Country of Publication:
- United States
- Language:
- English
Similar Records
Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors
Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors
Test results and prospects for RD53A, a large scale 65 nm CMOS chip for pixel readout at the HL-LHC
Journal Article
·
Wed Jan 01 00:00:00 EST 2014
·
OSTI ID:1128851
Results of Tests of Three-Dimensionally Integrated Chips Bonded to Sensors
Journal Article
·
Thu Jan 01 00:00:00 EST 2015
· IEEE Transactions on Nuclear Science
·
OSTI ID:1128851
+7 more
Test results and prospects for RD53A, a large scale 65 nm CMOS chip for pixel readout at the HL-LHC
Journal Article
·
Tue Nov 27 00:00:00 EST 2018
· Nuclear Instruments and Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment
·
OSTI ID:1128851