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Title: Method of fabricating a cooled electronic system

Abstract

A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Inventors:
; ; ; ; ; ; ; ; ;
Publication Date:
Research Org.:
International Business Machines Corporation, Armonk, NY, USA
Sponsoring Org.:
USDOE
OSTI Identifier:
1119677
Patent Number(s):
8,649,177
Application Number:
13/451,714
Assignee:
International Business Machines Corporation (Armonk, NY) DOEEE
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Method of fabricating a cooled electronic system. United States: N. p., 2014. Web.
Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, & Steinke, Mark E. Method of fabricating a cooled electronic system. United States.
Chainer, Timothy J, Gaynes, Michael A, Graybill, David P, Iyengar, Madhusudan K, Kamath, Vinod, Kochuparambil, Bejoy J, Schmidt, Roger R, Schultz, Mark D, Simco, Daniel P, and Steinke, Mark E. Tue . "Method of fabricating a cooled electronic system". United States. https://www.osti.gov/servlets/purl/1119677.
@article{osti_1119677,
title = {Method of fabricating a cooled electronic system},
author = {Chainer, Timothy J and Gaynes, Michael A and Graybill, David P and Iyengar, Madhusudan K and Kamath, Vinod and Kochuparambil, Bejoy J and Schmidt, Roger R and Schultz, Mark D and Simco, Daniel P and Steinke, Mark E},
abstractNote = {A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2014},
month = {2}
}

Patent:

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