Perforation patterned electrical interconnects
This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.
- Research Organization:
- ITN Energy Systems, Inc, Littleton, CO, USA
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AR0000019
- Assignee:
- ITN Energy Systems, Inc. (Littleton, CO)
- Patent Number(s):
- 8,637,996
- Application Number:
- 13/717,364
- OSTI ID:
- 1117867
- Country of Publication:
- United States
- Language:
- English
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