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Title: UCPD Model for Pb-Free Solder

Abstract

Abstract not provided.

Authors:
;
Publication Date:
Research Org.:
Sandia National Laboratories Albuquerque, NM; Sandia National Laboratories
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1109422
Report Number(s):
SAND2013-7526J
Journal ID: ISSN 1043-7398; 473627
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Journal Article
Journal Name:
Journal of Electronic Packaging
Additional Journal Information:
Journal Volume: 136; Journal Issue: 4; Other Information: ASME Proceedings, ISBN 978-0-7918-5575-1; Related Information: Proposed for publication in Journal of Electronic Packaging.; Journal ID: ISSN 1043-7398
Country of Publication:
United States
Language:
English

Citation Formats

Neilsen, Michael K., and Vianco, Paul T. UCPD Model for Pb-Free Solder. United States: N. p., 2014. Web. doi:10.1115/1.4026851.
Neilsen, Michael K., & Vianco, Paul T. UCPD Model for Pb-Free Solder. United States. doi:10.1115/1.4026851.
Neilsen, Michael K., and Vianco, Paul T. Fri . "UCPD Model for Pb-Free Solder". United States. doi:10.1115/1.4026851.
@article{osti_1109422,
title = {UCPD Model for Pb-Free Solder},
author = {Neilsen, Michael K. and Vianco, Paul T.},
abstractNote = {Abstract not provided.},
doi = {10.1115/1.4026851},
journal = {Journal of Electronic Packaging},
issn = {1043-7398},
number = 4,
volume = 136,
place = {United States},
year = {2014},
month = {9}
}