Advanced Packaging of SiC Power Module for Automotive Applications
- Authors:
-
- ORNL
- Publication Date:
- Research Org.:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
- Sponsoring Org.:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE)
- OSTI Identifier:
- 1093727
- DOE Contract Number:
- DE-AC05-00OR22725
- Resource Type:
- Conference
- Resource Relation:
- Conference: ECCE 2013, Denver, CO, USA, 20130915, 20130919
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Liang, Zhenxian, Ning, Puqi, and Wang, Fei. Advanced Packaging of SiC Power Module for Automotive Applications. United States: N. p., 2013.
Web.
Liang, Zhenxian, Ning, Puqi, & Wang, Fei. Advanced Packaging of SiC Power Module for Automotive Applications. United States.
Liang, Zhenxian, Ning, Puqi, and Wang, Fei. 2013.
"Advanced Packaging of SiC Power Module for Automotive Applications". United States.
@article{osti_1093727,
title = {Advanced Packaging of SiC Power Module for Automotive Applications},
author = {Liang, Zhenxian and Ning, Puqi and Wang, Fei},
abstractNote = {},
doi = {},
url = {https://www.osti.gov/biblio/1093727},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 01 00:00:00 EST 2013},
month = {Tue Jan 01 00:00:00 EST 2013}
}
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