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Title: Printable, flexible and stretchable diamond for thermal management

Abstract

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

Inventors:
; ; ; ; ; ;
Publication Date:
Research Org.:
Advanced Diamond Technologies, Inc. (Romeoville, IL), The Board of Trustees of the University of Illinois Semprius, Inc.
Sponsoring Org.:
USDOE
OSTI Identifier:
1086951
Patent Number(s):
8,470,701
Application Number:
12/418,071
Assignee:
Advanced Diamond Technologies, Inc. (Romeoville, IL), The Board of Trustees of the University of Illinois Semprius, Inc.
DOE Contract Number:  
FG02-91ER45439
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY

Citation Formats

Rogers, John A, Kim, Tae Ho, Choi, Won Mook, Kim, Dae Hyeong, Meitl, Matthew, Menard, Etienne, and Carlisle, John. Printable, flexible and stretchable diamond for thermal management. United States: N. p., 2013. Web.
Rogers, John A, Kim, Tae Ho, Choi, Won Mook, Kim, Dae Hyeong, Meitl, Matthew, Menard, Etienne, & Carlisle, John. Printable, flexible and stretchable diamond for thermal management. United States.
Rogers, John A, Kim, Tae Ho, Choi, Won Mook, Kim, Dae Hyeong, Meitl, Matthew, Menard, Etienne, and Carlisle, John. Tue . "Printable, flexible and stretchable diamond for thermal management". United States. https://www.osti.gov/servlets/purl/1086951.
@article{osti_1086951,
title = {Printable, flexible and stretchable diamond for thermal management},
author = {Rogers, John A and Kim, Tae Ho and Choi, Won Mook and Kim, Dae Hyeong and Meitl, Matthew and Menard, Etienne and Carlisle, John},
abstractNote = {Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2013},
month = {6}
}

Patent:

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