Reaction Between Thin Gold Wires And Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part C. A Comprehensive Model Of The Reaction Inside The Solder Mounds In Both The Interface Controlled Regime And The Diffusion-Controlled Regime.
- Authors:
- Publication Date:
- Research Org.:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1084719
- Report Number(s):
- LLNL-TR-637972
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Technical Report
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Siekhaus, W J. Reaction Between Thin Gold Wires And Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part C. A Comprehensive Model Of The Reaction Inside The Solder Mounds In Both The Interface Controlled Regime And The Diffusion-Controlled Regime.. United States: N. p., 2012.
Web. doi:10.2172/1084719.
Siekhaus, W J. Reaction Between Thin Gold Wires And Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part C. A Comprehensive Model Of The Reaction Inside The Solder Mounds In Both The Interface Controlled Regime And The Diffusion-Controlled Regime.. United States. doi:10.2172/1084719.
Siekhaus, W J. Tue .
"Reaction Between Thin Gold Wires And Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part C. A Comprehensive Model Of The Reaction Inside The Solder Mounds In Both The Interface Controlled Regime And The Diffusion-Controlled Regime.". United States.
doi:10.2172/1084719. https://www.osti.gov/servlets/purl/1084719.
@article{osti_1084719,
title = {Reaction Between Thin Gold Wires And Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part C. A Comprehensive Model Of The Reaction Inside The Solder Mounds In Both The Interface Controlled Regime And The Diffusion-Controlled Regime.},
author = {Siekhaus, W J},
abstractNote = {},
doi = {10.2172/1084719},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 14 00:00:00 EDT 2012},
month = {Tue Aug 14 00:00:00 EDT 2012}
}
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Reaction Between Thin Gold Wires and Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part A: The Radial Reaction Inside The Solder Mounds, Its Linear Reaction Model, Statistical Variation of Reaction Rate, and Induced Structural Changes In The Solder Mounds.
Thermodynamics favors the reaction between indium and gold, since the heat of formation of AuIn{sub 2} is 6 kcal/mole, substantially larger than the heat of formation of any other possible reaction product. Thermodynamic equilibrium between gold and the elements in the solder mound is reached only when ALL gold is converted to AuIn{sub 2}. There are two aspects to this conversion: (A) the reaction WITHIN the solder mound (called here 'radial reaction') and (B) the reaction OUTSIDE the solder mound (called here 'axial reaction') and the transition from (A) to (B). The reaction between thin gold detonator wires and themore » -
Reaction Between Thin Gold Wires and Pb-Sn-In Solder (37.5%, 37.5%, 25%), Part B. The Axial Reaction Of Gold Wires Soldered To PbSnIn Solder Mounds, Its effect On Electrical Resistance And Physical Structure.
Here we describe the gold-indium reaction along gold wires soldered at both ends. It begins with the combined radial/axial reaction in the vicinity of the solder mound as seen in metallurgical sections along the axis of the wire. We show that this combined radial/axial reaction has no effect on the resistance of the system, even though it shortens the length of the gold wire while converting it to gold indide. After this radial/axial reaction is complete, a purely axial reaction begins. For thin gold wires (i.e. 38.1 {micro}m diameter) the onset of that reaction is strongly correlated with the timemore »