Encapsulation methods for organic electrical devices
Patent
·
OSTI ID:1084088
The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
- Research Organization:
- NETL (National Energy Technology Laboratory, Pittsburgh, PA, and Morgantown, WV (United States))
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC26-06NT42936
- Assignee:
- SRI International (Menlo Park, CA)
- Patent Number(s):
- 8,466,011
- Application Number:
- 13/202,062
- OSTI ID:
- 1084088
- Country of Publication:
- United States
- Language:
- English
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