1D PIC-DSMC Microscale Breakdown Simulations.
Conference
·
OSTI ID:1072466
Abstract Not Provided
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000;
- OSTI ID:
- 1072466
- Report Number(s):
- SAND2012-8969C
- Conference Information:
- Proposed for presentation at the 65th Annual Gaseous Electronics Conference held October 22-26, 2012 in Austin, TX.
- Country of Publication:
- United States
- Language:
- English
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