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Title: Sealed substrate carrier for electroplating

Abstract

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Inventors:
 [1]
  1. Fremont, CA
Publication Date:
Research Org.:
SunPower Corporation (San Jose, CA)
Sponsoring Org.:
USDOE
OSTI Identifier:
1068864
Patent Number(s):
8,221,600
Application Number:
12/889,228
Assignee:
SunPower Corporation (San Jose, CA) GFO
DOE Contract Number:  
FC36-07GO17043
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Ganti, Kalyana Bhargava. Sealed substrate carrier for electroplating. United States: N. p., 2012. Web.
Ganti, Kalyana Bhargava. Sealed substrate carrier for electroplating. United States.
Ganti, Kalyana Bhargava. Tue . "Sealed substrate carrier for electroplating". United States. https://www.osti.gov/servlets/purl/1068864.
@article{osti_1068864,
title = {Sealed substrate carrier for electroplating},
author = {Ganti, Kalyana Bhargava},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 17 00:00:00 EDT 2012},
month = {Tue Jul 17 00:00:00 EDT 2012}
}

Patent:

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